All Products
| Model | Solution | SIZE/PACKAGE | Product description | Product detail |
|---|---|---|---|---|
| ST50HE | STM32WL SoC (High Band / Low Power) | 12*12*1.3 mm LGA73 |
The ST50HE SiP module built on Arm Cortex-M4 core with sub-GHz radio support from 863-930 MHz for LPWAN applications of LoRaWAN、sigfox. | LINK |
| ST50H | STM32WL SoC (High Band / High Power) | 12*12*1.3 mm LGA73 |
The ST50H SiP module built on Arm Cortex-M4 core with sub-GHz radio support from 863-930 MHz for LPWAN applications of LoRaWAN、sigfox. | LINK |
| ST50L | STM32WL SoC (Low Band / High Power) | 12*12*1.3 mm LGA73 |
The ST50L SiP module built on Arm Cortex-M4 core with sub-GHz radio support from 433-510 MHz for LPWAN applications of LoRaWAN regions: CN470, EU433. | LINK |
| AI50H | STM32WL SoC (Integrated RF Matching & Certification) | 20*20*1.95 mm LGA58 | The AI50H stamp hole module built on Arm Cortex-M4 core with sub-GHz radio support from 863-930 MHz for LPWAN applications of LoRaWAN and integrated antennas design for CE/FCC/TELEC/NCC approval. | LINK |
| AI2021L (New Product - Coming Soon) | Semtech LR2021 (Next-Gen Multi-Band RF) | 15.8*10*2.1mm LGA |
The AcSiP AI2021L is a next-generation, multi-band wireless transceiver module powered by Semtech’s fourth-generation LR2021 chipset. | LINK |
| AI1121L (New Product - Coming Soon) | Semtech LR1121 (Multi-Band RF) | 15.8*10*2.1mm LGA |
The AcSiP AI1121L is a multi-band LoRa® connectivity module designed for Internet of Things (IoT) LoRaWAN applications. | LINK |
| S68F | Semtech SX1268 (RF Transceiver 433~510MHz) | 9*8*1.3 mm LGA25 |
The AcSiP S68F SiP 2nd Gen LoRa solution as a small transceiver module with TCXO inside and support regions of EU433、CN470 | LINK |
| S62F | Semtech SX1262 (RF Transceiver 865~928MHz) | 9*8*1.3 mm LGA25 |
The AcSiP S62F SiP 2nd Gen LoRa solution as a small transceiver module with TCXO inside and support regions of EU868、AS923、US915、AU915 | LINK |
| S76S | SX1276 + STM32L073x | 13*11*1.1 mm LGA62 |
The S76S SiP module integrated Arm Cortex-M0+ MCU with LoRa transceiver for LPWAN IoT Applications. | LINK |
| EK-AI7931LD KIT | WiFi6 2.4/5G + BT 5 | EVB 2.4/5G antenna | New Mediatek Filogic 130 WiFi6/BT5 combo SoC development kit could help user to upgrade IoT feature as AIoT application according to this security base platform. This chip integrates Arm Cortex-M33 MCU, Wi-Fi 6 and Bluetooth 5.2 connectivity subsystems, a power management unit (PMU) . | LINK |
| AI7933CLD | ARM Cortex-M33 MCU + Wi-Fi 802.11 a/b/g/n/ac/ax + BLE 5.0 + HiFi4 DSP | 32*32*2.7 LGA104 I-PEX connector |
AI7933CLD is a highly integrated IoT module that features an ARM® Cortex-M33 application processor, a low power 1T1R IEEE 802.11a/b/g/n/ac/ax dual-band Wi-Fi subsystem, a Bluetooth v5.0 subsystem and a Power Management Unit (PMU). It feature audio subsystem With Tensilica HiFi4 processor for VAD Build in. |
LINK |
| EK-ST50HE KIT | High Band / Low Power / LoRa SoC SiP | EVB High band antenna |
The EK-ST50HE KIT board is a ARM Cortex-M4 with sub-GHz radio integrated +14 dBm power amplifer support from 863-930 MHz for LPWAN applications of LoRaWAN、sigfox. | LINK |
| EK-ST50H KIT | High Band / High Power / LoRa SoC SiP | EVB High band antenna |
The EK-ST50H KIT board is a ARM Cortex-M4 with sub-GHz radio integrated +21dBm power amplifer support from 863-930 MHz for LPWAN applications of LoRaWAN、sigfox. | LINK |
| EK-ST50L KIT | Low Band / High Power / LoRa SoC SiP | EVB Low band antenna |
The EK-ST50L KIT board is a ARM Cortex-M4 with sub-GHz radio integrated +21 dBm power amplifer support from 433-510 MHz for LPWAN applications of LoRaWAN. | LINK |
| AI7931LD | ARM Cortex-M33 MCU + Wi-Fi 802.11 a/b/g/n/ac/ax + BLE 5.0 | 32*32*2.7 LGA104 I-PEX connector |
AI7931LD is a highly integrated IoT module that features an ARM® Cortex-M33 application processor, a low power 1x1 802.11a/b/g/n/ac/ax dual-band Wi-Fi subsystem, a Bluetooth v5.0 subsystem and a Power Management Unit (PMU). | LINK |
| EK-S76SXB KIT | MCU + LoRa SiP | EVB High band antenna |
The S76S SiP module integrated Arm Cortex-M0+ MCU with LoRa transceiver for LPWAN IoT Applications.User can develop LoRa/LoRaWAN sensor app to verify its functions by this EVK. | LINK |
| EK-S68F KIT | LoRa SiP Transcevier | EVB High band antenna |
The AcSiP S68F SiP 2nd Gen LoRa solution as a small transceiver module with TCXO inside and support regions of EU433、CN470 | LINK |
| EK-S62F KIT | LoRa SiP Transcevier | EVB High band antenna |
The AcSiP S62F SiP 2nd Gen LoRa solution as a small transceiver module with TCXO inside and support regions of EU868、AS923、US915、AU915 | LINK |
| AI917L | ARM Cortex-M4 MCU + Wi-Fi 802.11 b/g/n/ax + BLE 5.4 | 16*12*2.1 LGA I-PEX connector |
The Acsip AI917L represents our lowest power Wi-Fi 6 plus Bluetooth LE 5.4 solution, making it ideal for ultra-low power IoT wireless devices using Wi-Fi®, Bluetooth, Matter, and IP networking for secure cloud connectivity. These modules are optimal for developing battery-operated devices that need long battery life. | LINK |
| AI917L | ARM Cortex-M4 MCU + Wi-Fi 802.11 b/g/n/ax + BLE 5.4 | 16*12*2.1 LGA I-PEX connector |
The Acsip AI917L represents our lowest power Wi-Fi 6 plus Bluetooth LE 5.4 solution, making it ideal for ultra-low power IoT wireless devices using Wi-Fi®, Bluetooth, Matter, and IP networking for secure cloud connectivity. These modules are optimal for developing battery-operated devices that need long battery life. | LINK |
| AI584LL | ARM Cortex-M33 with DSP extensions and FPU | 16*12*2.1 LGA41 I-PEX connector |
The AcSiP AI584LL represents our lowest power wireless solution, making it ideal for ultra-low power IoT wireless devices using Matter, Thread, Zigbee, and BLE, provides robust connectivity options for a wide range of IoT devices, from smart home products to industrial applications. | LINK |
| AI584LL | ARM Cortex-M33 with DSP extensions and FPU | 16*12*2.1 LGA41 I-PEX connector |
The AcSiP AI584LL represents our lowest power wireless solution, making it ideal for ultra-low power IoT wireless devices using Matter, Thread, Zigbee, and BLE, provides robust connectivity options for a wide range of IoT devices, from smart home products to industrial applications. | LINK |
| AI7933CLD | ARM Cortex-M33 MCU + Wi-Fi 802.11 a/b/g/n/ac/ax + BLE 5.0 + HiFi4 DSP | 32*32*2.7 LGA104 I-PEX connector |
AI7933CLD is a highly integrated IoT module that features an ARM® Cortex-M33 application processor, a low power 1T1R IEEE 802.11a/b/g/n/ac/ax dual-band Wi-Fi subsystem, a Bluetooth v5.0 subsystem and a Power Management Unit (PMU). It feature audio subsystem With Tensilica HiFi4 processor for VAD Build in. |
LINK |
| EK-AI7933CLD KIT | WiFi6 2.4/5G + BT 5 + HiFi4 DSP | EVB 2.4/5G antenna | New Mediatek Filogic 130 WiFi6/BT5 combo SoC development kit could help user to upgrade IoT feature as AIoT application according to this security base platform. This chip integrates Arm Cortex-M33 MCU, Wi-Fi 6 and Bluetooth 5.2 connectivity subsystems, a power management unit (PMU) and optional audio DSP. | LINK |