Rich I/O of SiP

SiP (System in Package) could be recognized as a new process technology to simplify the complex process of traditional IC design. SiP could help achieving application performance through combining those input/output interfaces from IC, RLC of SMD level, Flash/RAM, RF unit and so on, which are integrated within one device.

MORE...

Why LoRa

The LoRa solution has excellent features of long range and low power specially in wireless communication

MORE...

AIoT Application development

AI7931LD, AI7933CLD and AI7933ALD series models had launched for AIoT Application development.

MORE...