Rich I/O of SiP

SiP (System in Package) could be recognized as a new process technology to simplify the complex process of traditional IC design. SiP could help achieving application performance through combining those input/output interfaces from IC, RLC of SMD level, Flash/RAM, RF unit and so on, which are integrated within one device.

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Why LoRa

The LoRa solution has excellent features of long range and low power specially in wireless communication

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物聯網智造基地台灣IC智造年會

群登科技,AcSiP, 11/10於資策會主辦-物聯網智造基地台灣IC智造年會中主講物聯網應用模組-打造國產IC模組，介紹群登提供的最佳無線解決的模組方案給會展所有與會廠商，並說明目前熱門的AIoT應用產品 - AI7931LD, AI7933CLD 與ST50H 系列等具備物聯網方案中的最重要的無線傳輸的產品。

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