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IoT Service Hub Works with Partners to Create Ecosystem for Tech Innovation

Article by IoT Service Hub

Taiwan’s IC design and semiconductor industries are world-renowned, and its well-established vertically integrated supply chain has created an environment that facilitates innovative R&D. In this significant stage, IoT Service Hub also works with major domestic IC manufacturers, MediaTek, to apply the mature model EVB, and assist enterprise to realize their concept into products. 

At the end of November 2021, MediaTek took advantage of the maturity of the high-speed, low-latency Wi-Fi 6 technology, and expected the application of IoT to become more vigorous, bringing considerable industrial opportunities. The company thus launched a one-chip wireless networking system that can create a Wi-Fi 6 ecosystem – “Genio 130″ (formerly known as Filogic 130). Afterwards, MediaTek cooperated with the IoT Service Hub and partners to promote domestic IC EVBs “Genio 130″.  

Genio 130 is a perfect example of achieving higher energy efficiency with a small size and low power consumption. The optional audio DSP also proves ideal for product developers who are designing voice-enabled IoT devices. The IoT Service Hub aims to create innovative industrial-level applications for Taiwan’s IC AIoT. By joining hands with original IC manufacturer MediaTek, module manufacturer AcSiP, and related agent Silicon Application Corp.

Since the establishment of AcSiP Technology Corp., its core expertise of outstanding SiP miniature module technology has enabled the company to launch various communication solutions at the smallest size in the industry and continue to expand the adoption of SiP technology, establishing its leading role in the communication semiconductor industry. Keeping up with the booming development of IoT applications, AcSiP offers multiple wireless solutions that can simplify development complexity for clients, from various connectivity solutions to the combination of MCU and sensors.  

Positioned as a bridge between upstream IC manufacturers and downstream terminal applications, AcSiP has developed excellent market and has become a trusted partner of MediaTek, a tech giant in IC design. AcSiP’s position in the supply chain allows it to fully reflect market demand in the upstream and provide technical support to terminal manufacturers in the downstream. With such niche, it also became one of the partners of the IoT Service Hub to promote the domestic EVB “Genio 130” (formerly known as Filogic 130).  

IoT Service Hub does not only work with module manufacturer, but also need to promote how to use this EVB “Genio 130”. Therefore, IoT Service Hub works with HanYa Technology, one of the members of the “Domestic IC Expert Group”, assisted with technical support and carried out various functional tests and UX sharing of Genio 130 to help product developers get started more quickly.  

In order to allow domestic IC users to have more resources and accelerate the formation of an ecosystem, HanYa Technology has uploaded more than a dozen tutorial videos in which they tested or used the MediaTek Genio 130 EVB. All of them can be found on HanYa Technology’s YouTube channel. The rich content of the tutorials includes building a compilation environment, realizing Wi-Fi/Bluetooth function/connection, how to add programs to SDK projects on the EVB, realizing the application of smart speakers or voice assistants on Genio 130, uploading data to the cloud via wireless networking function of the EVB, etc. In these videos, HanYa Technology teaches users how to reach the goal step by step, hoping to help them get started with developing in a shorter period of time.   

HanYa Technology’s current teaching goal is to help users get familiar with the system, and then connect the EVB to the Arduino IDE environment; it first started with students so that HanYa Technology can gradually establish familiarity with domestic ICs to cultivate future talents in the field of technology. If domestic IC experts diagnose the products from an objective perspective, they can help eliminate blind spots in product development, and improve the competitiveness of domestic ICs in order to create the competitiveness of MIT products. 

In addition to establishing tutorial content, IoT Service Hub also provides technical support. Sintegration Corp. has been focusing on the integration of Wi-Fi, BLE, LoRa, and other wireless technologies for many years. The company is versed in creating diversified products according to customers’ needs and providing solutions for vertical IoT applications. Sintegration Corp. is familiar with the communication protocols, so as long as the customer informs the desired design concept, it can estimate the distance of the devices and implement wireless deployment.  

In view of the current trend of government tenders specifying the use of domestic ICs, Sintegration Corp said that although domestic ICs still have room for improvement in terms of advanced technologies as compared to those made by international manufacturers, the wireless technology of domestic ICs has developed into a quite mature stage. What is more, the reasonable price and easier channel of communication are also incentives for choosing domestic ICs.  

With AcSiP Technology Corp. as its parent company, Sintegration can communicate with major manufacturers in Taiwan with zero difficulties. At present, Sintegration uses ICs made by both MediaTek and Realtek companies, and there is also business cooperation between AcSiP (Sintegration’s parent company) and the two manufacturers. With such networking advantage, Sintegration is able to get comprehensive tech support at all times, an ideal setting which its clients can also benefit from. With rich collaboration experiences, Sintegration can provide customers with practical answers and assistance, with a wide array of validated modules available for reference, which can greatly reduce the time of trial and error.  

Sintegration will continue to assist startups to accomplish technological breakthroughs with professional diagnosis after carefully surveying the team’s pain points during R&D. Such intervention will not only shorten the development schedule and reduce costs, but also help the creative minds materialize their concepts. In this way, the end product can enter the production line and be mass-produced in a more efficient manner, and the team will be able to get ahead of the game and start their business.   

For more information, please visit our website or email Yi Hua Lin at yhlin@iii.org.tw 

(Advertisement by Industrial Development Bureau, MoEA)  

From:  IoT Times

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