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AI2021L (New Product - Coming Soon)

Semtech LR2021 (Next-Gen Multi-Band RF)
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US$ 0.00 Unit-price for online samples purchase only.
Please contact sales@acsip.com.tw for more information

Introduction
Specification
HDK
Support
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Introduction

The AcSiP AI2021L is a next-generation, multi-band wireless transceiver module powered by Semtech’s fourth-generation LR2021 chipset.

Engineered as a unified RF platform, it integrates Sub-GHz (433~510MHz / 863–930MHz), and 2.4GHz ISM operation into a single compact subsystem, eliminating the need for multiple radio designs across regional and application boundaries.

Key Features

Unified Multi-Band RF Platform

♦ Sub-GHz: 433~510MHz / 863~930MHz, receive sensitivity down to –142dBm (SF12 / 125kHz, RxBoosted = 1), transmit power up to +22dBm, supporting data rates up to 2.6Mbps (FLRC modulation)
♦ 2.4GHz ISM: 2400-2500MHz global operation, sensitivity down to -120dBm (SF7 / 406kHz, RxBoosted = 1), supporting data rates up to 2.6Mbps (FLRC modulation)

Advanced Modulation & Protocol Support

♦ Modulation: LoRa, (G)FSK, (G)MSK, FLRC, 4-FSK, O-QPSK, and LR-FHSS (transmit-only) for enhanced anti-interference
♦ Protocol stack: LoRaWAN (Sub-GHz and 2.4GHz), Bluetooth^®LE 5.0, IEEE^® 802.15.4 (Thread^® / Zigbee^TM), Wi-SUN, Wireless M-BUS

Protocols such as BLE, Thread, Zigbee, Wi‑SUN, and Z‑Wave require the main MCU to run the corresponding MAC / network protocol stack, whereas the AI2021LH only provides support for physical‑layer modulation/demodulation and packet processing.

Block Diagram

Receives an external low-frequency clock reference signal (32kHz) via the DIO11 pin.

This feature allows designers to inject a precise external clock signal into the device, enabling accurate timing in various scenarios, such as Wake On Radio applications that require synchronization protocols.

Technical Specification

Chipset	► LR2021
Model	► AI2021LH : 863~930MHz (Sub-G) , 2400~2500MHz (2.4G) ► AI2021LL : 433~510MHz (Sub-G) , 2400~2500MHz (2.4G)
Package	► LGA type module with shielding cover
Dimension	► 15.8mm x 10mm x 2.1mm (Typ.)
Operating Voltage	► 3.3V
Temperature	► Operating : -40℃ ~ +85℃ ► Storage : -40℃ ~ +105℃
Humidity	► Operating : 10 ~ 95% (Non-Condensing) ► Storage : 5 ~ 95% (Non-Condensing)

PIN Assignment
Pin No.	Pin Name	Pin No.	Pin Name
1	GND	20	GND
2	SPI_SCK	21	RF_SubG
3	SPI_MOSI	22	GND
4	SPI_MISO	23	GND
5	GND	24	GND
6	VCC_IN	25	GND
7	GND	26	RF_2G4
8	DIO10	27	GND
9	DIO11 (External_32k)	28	GND
10	GND	29	GND
—		30	GND
		31	GND
		32	GND
		33	BUSY
		34	GND
16	GND	35	RESET
17	GND	36	GND
18	GND	37	DIO9 (IRQ)
19	GND	38	SPI_NSS

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For more information, or for sales inquiries, please contact Acsip Technology Corp.

Comming Soon!

Item	Description	Download Link

Item	Description	Download Link

Contact

Chipset ► LR2021 Model

► AI2021LH : 863~930MHz (Sub-G) , 2400~2500MHz (2.4G)

► AI2021LL : 433~510MHz (Sub-G) , 2400~2500MHz (2.4G)

Package ► LGA type module with shielding cover Dimension ► 15.8mm x 10mm x 2.1mm (Typ.) Operating Voltage ► 3.3V Temperature

► Operating : -40℃ ~ +85℃

► Storage : -40℃ ~ +105℃

Humidity

► Operating : 10 ~ 95% (Non-Condensing)

► Storage : 5 ~ 95% (Non-Condensing)

PIN Assignment
Pin No.	Pin Name	Pin No.	Pin Name
1	GND	20	GND
2	SPI_SCK	21	RF_SubG
3	SPI_MOSI	22	GND
4	SPI_MISO	23	GND
5	GND	24	GND
6	VCC_IN	25	GND
7	GND	26	RF_2G4
8	DIO10	27	GND
9	DIO11 (External_32k)	28	GND
10	GND	29	GND
—		30	GND
		31	GND
		32	GND
		33	BUSY
		34	GND
16	GND	35	RESET
17	GND	36	GND
18	GND	37	DIO9 (IRQ)
19	GND	38	SPI_NSS

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AI2021L (New Product - Coming Soon)

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