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AI917L
ARM Cortex-M4 MCU + Wi-Fi 802.11 b/g/n/ax + BLE 5.4
Inventory: Unavailable -
US$
0.00
Unit-price for online samples purchase only.
Please contact sales@acsip.com.tw for more information
Introduction
The Acsip AI917L represents our lowest power Wi-Fi 6 plus Bluetooth LE 5.4 solution, making it ideal for ultra-low power IoT wireless devices using Wi-Fi®, Bluetooth, Matter, and IP networking for secure cloud connectivity. These modules are optimal for developing battery-operated devices that need long battery life.
Both models share the same core architecture, including an ultra-low power Wi-Fi 6 plus Bluetooth Low Energy (LE) 5.4 wireless CPU subsystem, and an integrated microcontroller (MCU) application subsystem, security, peripherals, and power management subsystem.
The wireless subsystem consists of a multi-threaded Network Wireless Processor (NWP) running up to 160 MHz, baseband digital signal processing, analog front end, 2.4 GHz RF transceiver, and integrated power amplifier.
The application subsystem consists of an ARM® Cortex®-M4 running up to 180 MHz, embedded SRAM, FLASH, ultra-low power sensor hub, and matrix vector processor.
The ARM® Cortex®-M4 is dedicated for peripheral and application-related processing, while the NWP runs the wireless and networking stacks on independent threads, thus providing a fully integrated solution for a wide range of embedded wireless IoT applications.
Key Features
| ♦ Single Stream Wi-Fi 6 | ♦ Ultra-Low Power Consumption |
| • IEEE 802.11 b/g/n/ax 2.4GHz 1x1 20MHz | • Wi-Fi 6 Standby Associated Mode: 25μA |
| • 802.11ax OFDMA, DL MU-MIMO, Target Wake Time | (TWT with auto config feature enabled. TWT Rx latency 60s with 8ms wakeup duration. WLAN keep-alive every 60s. 352kB SRAM retention.) |
| • Tx power: +18 dBm | |
| • Rx Sensitivity: -97.5 dBm | • Wi-Fi 4 Standby Associated Mode: 71μA DTIM10 (WLAN keep-alive 30s) |
| • Data Rates: 802.11 ax MCS0 to MCS7 | • Deep sleep current: ~4.5μA |
| • Wireless Network Processor 160MHz | • Sleep / Standby current (352kB RAM retention) : ~11μA |
| ♦ Bluetooth Low Engergy 5.4 | ♦ Memory |
| • Tx power: +17 dBm | • SRAM 672kB (320kB for application) |
| • Rx sensitivity: -105.5 dBm @ 125 kbps | • In-package Flash 8MB |
| • Data rates: 1, 2 Mbps, LR (125 kbps, 500 kbps) | • External PSRAM support up to 16MB |
| • Profiles: GAP, GATT, SMP, LE L2CAP |
| ♦ ARM Cortex@M4 Processor with FPU Subsystem | ♦ Security |
| • Application Core up to 180MHz 225DMIPS | • WPA2, WPA3(Personal / Enterprise) |
| • High speed Peripherals: SDIO, UART, (Q)SPI, I2C, I2S, PWM, RTC and Timers | • TLS 1.3, TLS 1.2 |
| • Ultra Low Power Peripherals: RTC, BOD, UART, I2C, I2S, GPIO, and Timers | • Secure Boot/OTA, PUF, TRNG, Secure Key Storage, Debug Lock, Anti Rollback, Encrypted XiP and Secure Attestation |
| • Analog Peripherals: 12-bit ADC/DAC, Op-Amp, Comparator, and Temp Sensor | |
| • Dedicated core for AI/ML 320M operations per second |
| ♦ Software and Protocol Support | |
| • Integrated Wi-Fi stack with Bluetooth LE coexistence and Matter over Wi-Fi | |
| • Offloaded from Cortex-M4: TCP/IP stack with HTTP/S, TLS, DHCP, MQTT |
The IoT module of AI917L with WiFi6 / BLE5 that can support Matter 1.0 now.

| Developing Resource | |||
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Related Products
For more information, or for sales inquiries, please contact Acsip Technology Corp.
General Description
The Acsip AI917L represents our lowest power Wi-Fi 6 plus Bluetooth LE 5.4 solution, making it ideal for ultra-low power IoT wireless devices using Wi-Fi®, Bluetooth, Matter, and IP networking for secure cloud connectivity. These modules are optimal for developing battery-operated devices that need long battery life.
Both models share the same core architecture, including an ultra-low power Wi-Fi 6 plus Bluetooth Low Energy (LE) 5.4 wireless CPU subsystem, and an integrated microcontroller (MCU) application subsystem, security, peripherals, and power management subsystem.
The wireless subsystem consists of a multi-threaded Network Wireless Processor (NWP) running up to 160 MHz, baseband digital signal processing, analog front end, 2.4 GHz RF transceiver, and integrated power amplifier.
The application subsystem consists of an ARM® Cortex®-M4 running up to 180 MHz, embedded SRAM, FLASH, ultra-low power sensor hub, and matrix vector processor.
The ARM® Cortex®-M4 is dedicated for peripheral and application-related processing, while the NWP runs the wireless and networking stacks on independent threads, thus providing a fully integrated solution for a wide range of embedded wireless IoT applications.
Block Diagram

Certification
| FCC ID | Planned |
| CE | Planned |
Recommended Operrating Range
| Symbol | Parameter | Min. | Typ. | Max. | Unit | |
| VBATT | 3.3V Supply Voltage | 2.97 | 3.3 | 3.63 | V | |
| IO_VDD | I/O supply for GPIOs | 1.8V | 1.71 | 1.8 | 1.98 | V |
| 3.3V | 2.97 | 3.3 | 3.63 | V | ||
| PA_AVDD | Power supply for the 2.4 GHz RF Power Amplifier. | 2.97 | 3.3 | 3.63 | V | |
| RF_VBAT | Always-on VBATT Power supply to the RF | 2.97 | 3.3 | 3.63 | V | |
| ULP_IO_VDD | I/O supply for ULP I/Os | 2.97 | 3.3 | 3.63 | V |
Wi-Fi Current Consumption
| Item | Condition | Min. | Typ. | Max. | Unit | |
| Active Receiver Current | 1Mbps DSSS | 57 | mA | |||
| 11Mbps CCK | 57 | mA | ||||
| 6Mbps OFDM | 63 | mA | ||||
| 54Mbps OFDM | 63 | mA | ||||
| HT20 MCS0 Mixed | 62 | mA | ||||
| HT20 MCS7 Mixed | 63 | mA | ||||
| HE20 MCS0 SU | 63 | mA | ||||
| HE20 MCS7 SU | 63 | mA | ||||
| Item | Condition | Min. | Typ. | Max. | Unit | |
| Transmit Current | 1Mbps DSSS, @18dBm | 182 | 195 | mA | ||
| 11Mbps CCK, @18dBm | 135 | 144 | mA | |||
| 6Mbps OFDM, @18dBm | 161 | 172 | mA | |||
| 54Mbps OFDM, @15dBm | 91 | 98 | mA | |||
| HT20 MCS0 Mixed, @18dBm | 160 | 171 | mA | |||
| HT20 MCS7 Mixed, @14dBm | 98 | 103 | mA | |||
| HE20 MCS0 SU, @18dBm | 157 | 168 | mA | |||
| HE20 MCS7 SU, @12dBm | 96 | 102 | mA | |||
Bluetooth LE Current Consumption
| Item | Condition | Min. | Typ. | Max. | Unit |
|
Rx Active Current |
LE Mode-1Mbps | - | 44.5 | - | mA |
| LE Mode-2Mbps | - | 44.5 | - | mA | |
| LE Mode-500kbps | - | 44.5 | - | mA | |
| LE Mode-125kbps | - | 44.5 | - | mA |
| Item | Condition | Min. | Typ. | Max. | Unit |
|
Tx Active Current HP Mode (19dBm RF Chain) |
LE Mode-1Mbps | 160 | - | 167 | mA |
| LE Mode-2Mbps | 95 | - | 106 | mA | |
| LE Mode-500kbps | 164 | - | 188 | mA | |
| LE Mode-125kbps | 178 | - | 207 | mA |
| Item | Condition | Min. | Typ. | Max. | Unit |
|
Tx Active Current LP Mode (0dBm RF Chain) |
LE Mode-1Mbps | 22 | - | 23 | mA |
| LE Mode-2Mbps | 21 | - | 23 | mA | |
| LE Mode-500kbps | 22 | - | 23 | mA | |
| LE Mode-125kbps | 21 | - | 23 | mA |
| Item | Condition | Min. | Typ. | Max. | Unit |
|
Tx Active Current LP Mode (8dBm RF Chain) |
LE Mode-1Mbps | 30 | - | 32 | mA |
| LE Mode-2Mbps | 24 | - | 25 | mA | |
| LE Mode-500kbps | 31.5 | - | 32.5 | mA | |
| LE Mode-125kbps | 32.5 | - | 33.5 | mA |
MCU Power State Current Consumption
| Item | Condition | Min. | Typ. | Max. | Unit |
| PS4 Supply Current | Sleep, 320 KB RAM retained, SRAM PERI ON, | - | 13.7 | - | μA |
| Active - Default configuration | - | 12.7 | - | mA | |
| PS3 Supply Current | Sleep, 320 KB RAM retained, SRAM PERI ON, | - | 13.7 | - | μA |
| Active - Default configuration | - | 7.6 | - | mA | |
| PS2 Supply Current | Sleep, 320 KB RAM retained, SRAM PERI ON, | - | 13.7 | - | μA |
| Active - Default configuration | - | 808 | - | μA | |
| PS1 Supply Current | 320 KB RAM retained, SRAM PERI ON, | - | 309 | - | μA |
| PS0 Supply Current | Without RAM retained, SRAM PERI ON, | - | 1.44 | - | μA |
Mechanical Dimensions
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For further information of those items listed behind within datasheet
Please check with Datasheet for downloading or mail to sales@acsip.com.tw for full technical support.
♦ RF Characteristics
♦ Pin definition
♦ Power Mode
♦ Recommended Reflow Profile
♦ Module Preparation
♦ Package Information
Related Resource
Related Products
For more information, or for sales inquiries, please contact Acsip Technology Corp.
| Item | Description | Download Link |
|---|---|---|
| Product Brief | AI917_Brief_Ver.03.pdf | Free |
| Product Spec. (Datasheet) | AI917Lx_SPEC_Ver.A.pdf | LoginContact Us |
| Item | Description | Download Link |
|---|











