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Introduction

The Acsip AI917L represents our lowest power Wi-Fi 6 plus Bluetooth LE 5.4 solution, making it ideal for ultra-low power IoT wireless devices using Wi-Fi®, Bluetooth, Matter, and IP networking for secure cloud connectivity. These modules are optimal for developing battery-operated devices that need long battery life.

Both models share the same core architecture, including an ultra-low power Wi-Fi 6 plus Bluetooth Low Energy (LE) 5.4 wireless CPU subsystem, and an integrated microcontroller (MCU) application subsystem, security, peripherals, and power management subsystem.

The wireless subsystem consists of a multi-threaded Network Wireless Processor (NWP) running up to 160 MHz, baseband digital signal processing, analog front end, 2.4 GHz RF transceiver, and integrated power amplifier.

The application subsystem consists of an ARM® Cortex®-M4 running up to 180 MHz, embedded SRAM, FLASH, ultra-low power sensor hub, and matrix vector processor.

The ARM® Cortex®-M4 is dedicated for peripheral and application-related processing, while the NWP runs the wireless and networking stacks on independent threads, thus providing a fully integrated solution for a wide range of embedded wireless IoT applications.


Key Features

 Single Stream Wi-Fi 6  Ultra-Low Power Consumption
• IEEE 802.11 b/g/n/ax 2.4GHz 1x1 20MHz • Wi-Fi 6 Standby Associated Mode: 25μA
• 802.11ax OFDMA, DL MU-MIMO, Target Wake Time (TWT with auto config feature enabled. TWT Rx latency 60s with 8ms wakeup duration. WLAN keep-alive every 60s. 352kB SRAM retention.)
• Tx power: +18 dBm  
• Rx Sensitivity: -97.5 dBm • Wi-Fi 4 Standby Associated Mode: 71μA DTIM10 (WLAN keep-alive 30s)
• Data Rates: 802.11 ax MCS0 to MCS7 • Deep sleep current: ~4.5μA
• Wireless Network Processor 160MHz • Sleep / Standby current (352kB RAM retention) : ~11μA
 Bluetooth Low Engergy 5.4  Memory
Tx power: +17 dBm • SRAM 672kB (320kB for application)
• Rx sensitivity: -105.5 dBm @ 125 kbps • In-package Flash 8MB
Data rates: 1, 2 Mbps, LR (125 kbps, 500 kbps) • External PSRAM support up to 16MB
Profiles: GAP, GATT, SMP, LE L2CAP  
ARM Cortex@M4 Processor with FPU Subsystem  Security
• Application Core up to 180MHz 225DMIPS • WPA2, WPA3(Personal / Enterprise)
• High speed Peripherals: SDIO, UART, (Q)SPI, I2C, I2S, PWM, RTC and Timers • TLS 1.3, TLS 1.2
• Ultra Low Power Peripherals: RTC, BOD, UART, I2C, I2S, GPIO, and Timers • Secure Boot/OTA, PUF, TRNG, Secure Key Storage, Debug Lock, Anti Rollback, Encrypted XiP and Secure Attestation
• Analog Peripherals: 12-bit ADC/DAC, Op-Amp, Comparator, and Temp Sensor  
• Dedicated core for AI/ML 320M operations per second  
Software and Protocol Support  
Integrated Wi-Fi stack with Bluetooth LE coexistence and Matter over Wi-Fi  
• Offloaded from Cortex-M4: TCP/IP stack with HTTP/S, TLS, DHCP, MQTT  

The IoT module of AI917L with WiFi6 / BLE5 that can support Matter 1.0 now.


  Developing Resource    
⇒     
 

Related Products

AI584LL

ARM Cortex-M33 with DSP extensions and FPU

AI917L

ARM Cortex-M4 MCU + Wi-Fi 802.11 b/g/n/ax + BLE 5.4

AI7931LD

ARM Cortex-M33 MCU + Wi-Fi 802.11 a/b/g/n/ac/ax + BLE 5.0

AI7933CLD

ARM Cortex-M33 MCU + Wi-Fi 802.11 a/b/g/n/ac/ax + BLE 5.0 + HiFi4 DSP

EK-AI7931LD KIT

WiFi6 2.4/5G + BT 5

EK-AI7933CLD KIT

WiFi6 2.4/5G + BT 5 + HiFi4 DSP


For more information, or for sales inquiries, please contact Acsip Technology Corp. 

General Description

The Acsip AI917L represents our lowest power Wi-Fi 6 plus Bluetooth LE 5.4 solution, making it ideal for ultra-low power IoT wireless devices using Wi-Fi®, Bluetooth, Matter, and IP networking for secure cloud connectivity. These modules are optimal for developing battery-operated devices that need long battery life.

Both models share the same core architecture, including an ultra-low power Wi-Fi 6 plus Bluetooth Low Energy (LE) 5.4 wireless CPU subsystem, and an integrated microcontroller (MCU) application subsystem, security, peripherals, and power management subsystem.

The wireless subsystem consists of a multi-threaded Network Wireless Processor (NWP) running up to 160 MHz, baseband digital signal processing, analog front end, 2.4 GHz RF transceiver, and integrated power amplifier.

The application subsystem consists of an ARM® Cortex®-M4 running up to 180 MHz, embedded SRAM, FLASH, ultra-low power sensor hub, and matrix vector processor.

The ARM® Cortex®-M4 is dedicated for peripheral and application-related processing, while the NWP runs the wireless and networking stacks on independent threads, thus providing a fully integrated solution for a wide range of embedded wireless IoT applications.


Block Diagram

                              


Certification

FCC ID Planned
CE Planned

Recommended Operrating Range

Symbol Parameter   Min. Typ. Max. Unit
VBATT 3.3V Supply Voltage   2.97 3.3 3.63 V
IO_VDD I/O supply for GPIOs 1.8V 1.71 1.8 1.98 V
3.3V 2.97 3.3 3.63 V
PA_AVDD Power supply for the 2.4 GHz RF Power Amplifier.   2.97 3.3 3.63 V
RF_VBAT Always-on VBATT Power supply to the RF   2.97 3.3 3.63 V
ULP_IO_VDD I/O supply for ULP I/Os   2.97 3.3 3.63 V

Wi-Fi Current Consumption

Item Condition Min. Typ. Max. Unit
Active Receiver Current 1Mbps DSSS   57   mA
11Mbps CCK   57   mA
6Mbps OFDM   63   mA
54Mbps OFDM   63   mA
HT20 MCS0 Mixed   62   mA
HT20 MCS7 Mixed   63   mA
HE20 MCS0 SU   63   mA
HE20 MCS7 SU   63   mA
Item Condition Min. Typ. Max. Unit
Transmit Current 1Mbps DSSS, @18dBm 182   195 mA
11Mbps CCK, @18dBm 135   144 mA
6Mbps OFDM, @18dBm  161   172 mA
54Mbps OFDM, @15dBm 91   98 mA
HT20 MCS0 Mixed, @18dBm  160   171 mA
HT20 MCS7 Mixed, @14dBm 98   103 mA
HE20 MCS0 SU, @18dBm  157   168 mA
HE20 MCS7 SU, @12dBm 96   102 mA

Bluetooth LE Current Consumption

Item Condition Min. Typ. Max. Unit

Rx Active Current

LE Mode-1Mbps - 44.5 - mA
LE Mode-2Mbps - 44.5 - mA
LE Mode-500kbps - 44.5 - mA
LE Mode-125kbps - 44.5 - mA
Item Condition Min. Typ. Max. Unit

Tx Active Current

HP Mode (19dBm RF Chain)

LE Mode-1Mbps 160 - 167 mA
LE Mode-2Mbps 95 - 106 mA
LE Mode-500kbps 164 - 188 mA
LE Mode-125kbps 178 - 207 mA
Item Condition Min. Typ. Max. Unit

Tx Active Current

LP Mode (0dBm RF Chain)

LE Mode-1Mbps 22 - 23 mA
LE Mode-2Mbps 21 - 23 mA
LE Mode-500kbps 22 - 23 mA
LE Mode-125kbps 21 - 23 mA
Item Condition Min. Typ. Max. Unit

Tx Active Current

LP Mode (8dBm RF Chain)

LE Mode-1Mbps 30 - 32 mA
LE Mode-2Mbps 24 - 25 mA
LE Mode-500kbps 31.5 - 32.5 mA
LE Mode-125kbps 32.5 - 33.5 mA

MCU Power State Current Consumption

Item Condition Min. Typ. Max. Unit
PS4 Supply Current Sleep, 320 KB RAM retained, SRAM PERI ON, - 13.7 - μA
Active - Default configuration - 12.7 - mA
PS3 Supply Current Sleep, 320 KB RAM retained, SRAM PERI ON, - 13.7 - μA
Active - Default configuration - 7.6 - mA
PS2 Supply Current Sleep, 320 KB RAM retained, SRAM PERI ON, - 13.7 - μA
Active - Default configuration - 808 - μA
PS1 Supply Current 320 KB RAM retained, SRAM PERI ON, - 309 - μA
PS0 Supply Current Without RAM retained, SRAM PERI ON, - 1.44 - μA

Mechanical Dimensions


For further information of those items listed behind within datasheet

Please check with Datasheet for downloading or mail to sales@acsip.com.tw for full technical support.

♦ RF Characteristics
♦ Pin definition
♦ Power Mode
♦ Recommended Reflow Profile
♦ Module Preparation
♦ Package Information


Related Resource

► Product Brief

► Datasheet


Related Products

AI584LL

ARM Cortex-M33 with DSP extensions and FPU

AI917L

ARM Cortex-M4 MCU + Wi-Fi 802.11 b/g/n/ax + BLE 5.4

AI7931LD

ARM Cortex-M33 MCU + Wi-Fi 802.11 a/b/g/n/ac/ax + BLE 5.0

AI7933CLD

ARM Cortex-M33 MCU + Wi-Fi 802.11 a/b/g/n/ac/ax + BLE 5.0 + HiFi4 DSP

EK-AI7931LD KIT

WiFi6 2.4/5G + BT 5

EK-AI7933CLD KIT

WiFi6 2.4/5G + BT 5 + HiFi4 DSP


For more information, or for sales inquiries, please contact Acsip Technology Corp. 

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Product Brief AI917_Brief_Ver.03.pdf Free
Product Spec. (Datasheet) AI917Lx_SPEC_Ver.A.pdf LoginContact Us
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